Apple announced a multi-year agreement with chipmaker Broadcom valued at over $30 billion, marking its largest US manufacturing commitment to date. The deal aims to produce more than 15 billion US-made chips and includes a $1.5 billion expansion of Broadcom’s Fort Collins, Colorado facility, the company said on Wednesday, July 8, 2026.
The partnership expansion will support hundreds of American jobs and significantly boost domestic chip manufacturing capacity. Apple’s press release detailed that the agreement covers the production of billions of chips in the United States, although the timeline for the new manufacturing capacity to come online was not disclosed. The $1.5 billion investment will enhance Broadcom’s existing operations in Colorado.
This commitment underscores Apple’s strategic push to strengthen its supply chain within the US amid global semiconductor shortages and geopolitical tensions. The scale of the deal surpasses previous US manufacturing investments by Apple, reflecting the broader industry trend of reshoring chip production. Comparable large-scale agreements in the semiconductor sector have been critical in addressing supply chain vulnerabilities and supporting local economies.
Broadcom’s Fort Collins facility expansion is a concrete step toward increasing US chip production capacity. The agreement’s scale and investment level make it one of the most significant US semiconductor manufacturing commitments announced this year, according to livemint.com.