Citadel Securities LLC projects that over $500 billion in debt will be issued by 2028 to finance chips used in artificial intelligence data centers, according to Bloomberg via livemint.com. This amount would represent more than 5% of the Bloomberg US high-grade credit index, highlighting the scale of borrowing expected in the semiconductor sector over the next two years.
Jeff Eason, head investment-grade desk analyst at Citadel Securities, explained that most of this debt issuance will likely be shorter-dated, with maturities around three to five years to align with the lifespan of the chips. He also noted that a portion of the financing could come through 144A private offerings, which are exempt from certain registration requirements and typically targeted at qualified institutional buyers.
The forecast underscores the growing capital needs of technology companies expanding their AI infrastructure, as chip demand surges. Eason described this financing trend as potentially becoming one of the largest new sectors within investment-grade credit markets. The $500 billion figure may be conservative given the rapid pace of AI adoption and chip deployment, signaling significant implications for credit markets and investors.
Citadel Securities' forecast was shared in an interview published on August 4, 2026, marking a notable projection for the scale of chip-related debt issuance in the coming years.